On November 28, 2019, the 2019 Beijing Microelectronics International Symposium and IC WORLD Conference (IC WORLD Conference is the World Integrated Circuit Conference) was grandly opened at the Yichuang International Convention and Exhibition Center in Beijing Yizhuang Economic and Technological Development Zone. The conference was hosted by the Beijing Municipal Bureau of Economy and Information Technology, Beijing Economic and Technological Development Zone Management Committee, Beijing Semiconductor Industry Association, International Semiconductor Industry Association, American Huamei Semiconductor Association, Zhongguancun Integrated Circuit Industry Alliance, Zhongguancun Integrated Circuit Material Industry Technology Innovation Alliance, Integrated Circuit Parts Industry Technology Innovation Alliance, Northern Integrated Circuit Industry Technology Innovation Development (Beijing) Co., Ltd. jointly organized.
With the theme of "Building Core Ecology and Promoting New Leaps Together", the conference aims to become the leading industry event in the industry and offer suggestions for the development of integrated circuit industry. The conference consists of two parts: academic conference and exposition. The academic conference invited nearly 200 well-known experts, scholars and business leaders in the industry to carry out high-level academic exchanges around the development status and trends of the integrated circuit industry, intelligent manufacturing, breakthrough innovation of materials and parts, and investment and financing of the semiconductor industry. The exhibition hall of
Expo covers an area of about 10000 ㎡, and the booth area exceeds 4000 ㎡. Nearly 170 units participated in the exhibition. The expo exhibited a number of the latest achievements and technologies of the integrated circuit industry, including: logic chips, memory chips, integrated circuit design wafer processing equipment, wafer processing materials, packaging and testing materials, artificial intelligence, Internet of Things, etc., and through Relevant companies in the industry chain build a communication platform in order to achieve the goal of the industry to jointly promote the healthy and rapid development of the integrated circuit industry.
At this conference, Neville Science and Technology mainly demonstrated its MEMS business sectors, including the industry-leading wafer production process and growing foundry capacity and production capacity of its wholly-owned subsidiary, Silex, Sweden. It also highlighted the advantages of mass-produced MEMS wafer manufacturing plants in China and the progress of the 8-inch MEMS international foundry line under construction in Beijing, attracted a large number of visitors to the consultation and exchange.
Customers from China, Germany, Holland and other countries exchange
Sweden Silex has been focusing on MEMS chip process development and wafer manufacturing for a long time, and has the world's advanced pure MEMS contract manufacturing process and growing contract manufacturing capacity. In the 2018 ranking of global MEMS wafer manufacturers, Sweden Silex continues to rank second among pure manufacturers and fourth among manufacturers.
Under the background that the domestic MEMS industrialization level is relatively low and high-end products are heavily dependent on imports, Neville Technology adheres to the principle of "learning from the advanced and landing at home", digests and absorbs foreign advanced technologies through the acquisition of Silex of Sweden, and promotes the integration of domestic process lines with its outstanding industry status and high-quality customer resources, gradually improves the local process development team, and combines with China's huge application market, gradually realize the MEMS advanced manufacturing platform landing domestic, service industry.
At present, the 8-inch MEMS international foundry line jointly invested by Neville Technology and the National Integrated Circuit Industry Fund in Yizhuang, Beijing represents the advanced level and large-scale production capacity in the MEMS field. When completed and put into production, it will provide mature technical support and capacity guarantee for the research and development and mass production of global MEMS product customers, and actively promote and accelerate the industrial application process of MEMS sensors in the Internet of Things era.