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Stock Code 300456
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Magnetic Material

Vias

1

DRIE

1

Wafer Bonding

1

Piezoelectric Material

1

Magnetic Material

Wafer-level Cap

1

Vias

1

DRIE

1

Wafer Bonding

1

Piezoelectric Material

1

Magnetic Material

Wafer-level Cap

1

Stock Code 300456
North Ring Center, Xicheng District, Beijing
Yard 21, Kechuang 8th Street, BDA, Beijing
010-87018118, 010-59702088 smeiic@smeiic.com
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Home
About SMEI
Our Company Chairman's Speech Corporate Culture History
Business
MEMS Investment
Investors
Governance Periodic Report Financial Index Investor Activity
News
Company News
Contact Us

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